What is failure analysis for electronic components?

Failure analysis for electronic components is a systematic investigation that uses electrical testing, imaging, and physical analysis to determine why a device failed. AAA Engineering & Test Lab focuses on semiconductors and electronic parts for aerospace, defense, space, medical electronics, automotive, and industrial systems, not medical or clinical samples.

What failure analysis techniques does AAA use?

AAA Engineering & Test Lab can combine non-destructive methods such as electrical testing, X-ray, CSAM, and visual inspection with destructive techniques like decapsulation and die inspection, cross-sectioning, SEM/EDS analysis, and bond pull or ball shear testing. The specific approach is tailored to the failure mode and the customer’s objectives.

When should I request failure analysis on a component?

Failure analysis is recommended when field returns increase, units fail incoming inspection or test, intermittent behavior is observed, or there are concerns about workmanship, assembly, or potential counterfeit issues. A structured investigation helps determine whether the root cause is related to design, manufacturing, handling, storage, assembly, or application conditions.

How does failure analysis support reliability and quality programs?

Failure analysis provides the data needed to implement corrective and preventive actions, refine screening and qualification flows, and update specifications or handling procedures. For high-reliability programs, it is a key tool for closing the loop between field performance, reliability predictions, and supplier or process controls.

Failure Analysis

Failure Analysis Services

Accuracy. Reliability. Expertise.

At AAA Engineering & Test Lab, we diagnose the root causes of component failures for programs in aerospace, defense, medical, automotive, and high-reliability consumer electronics, ensuring the most advanced systems achieve unwavering reliability. Our engineers design meticulous failure analysis (FA) and destructive physical analysis (DPA) protocols to meet MIL-STD-883, MIL-STD-1580, AS6171, JESD22, and custom specifications, delivering actionable insights with engineering precision. We empower you to resolve defects and maintain mission-critical performance with confidence.

Our ANSI ESD S20.20-certified, FOD-controlled lab is equipped with ISO 9001/AS9100-calibrated SEM, XRF spectrometers, X-Ray systems, and high-resolution/ high-magnification microscopes. We perform comprehensive tests to identify material, electrical, and structural defects, providing traceable data logs and high-resolution imaging that support engineers in optimizing designs and supply chain teams in ensuring component integrity.

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Failure Analysis Capabilities

Performed in an ISO 9001/AS9100-calibrated, ANSI ESD S20.20-compliant lab environment:

Cross-Sectional Analysis (Metallography): Exposes internal construction to evaluate plating, via integrity, and delamination, per JESD22-B100.
Decapsulation and Die Inspection: Opens packages to inspect die and internal features, per MIL-STD-883 Method 5009 or MIL-STD-1580.
Electrical Parametric Testing: Measures current, voltage, and timing pre/post-stress to identify failure modes, per MIL-STD-883 Methods 3005-3012.
External Visual Inspection: Checks for physical defects or counterfeit indicators, per AS6171/2 or MIL-STD-883 Method 2009.
Scanning Acoustic Microscopy (CSAM): Detects internal delamination or voids, per MIL-STD-883 Method 2030.
Scanning Electron Microscopy (SEM)/Energy-Dispersive X-Ray Spectroscopy (EDS): Analyzes surface and elemental composition, per MIL-STD-883 Method 2018.
Surface Contamination Testing: Identifies performance-affecting contaminants, per JESD22-B101 or ASTM F1598.
Wire Bond & Die Attach Analysis: Evaluates bond strength and die attachment, per MIL-STD-883 Method 2011.
X-Ray Inspection: Detects internal defects or counterfeit features, per AS6171/4 or MIL-STD-883 Method 2012.

Applications

Field Return Analysis: Diagnoses failures in avionics, munitions, and medical devices.
Production Yield Optimization: Identifies defects in PCB assemblies for aerospace and automotive systems.
Reliability Investigations: Analyzes early life failures, ESD, or moisture damage in space hardware.
Supplier Qualification: Validates components for oil & gas and consumer electronics programs.

Why Customers Choose AAA Engineering

American Owned: We are 100% American owned, and operated by veterans of the US Air Force, US Army, US Marines, and US Navy.
Proven Expertise: 15+ years of upscreening and component data.
Technical Authority: Skilled in MIL-STD, NASA, and AS6171 standards.
Certified Excellence: ISO/IEC 17025, AS6081, AS6171, ISO 9001/AS9100, ANSI/ESD S20.20, ITAR-registered.
Trusted Results: Transparent, traceable data logs for reliability.
Scalable Solutions: Supports prototype to production volumes.

Contact us to develop a tailored failure analysis plan for your components

Certifications

Industries Served

Aerospace & Defense

Ensuring electronics within weapon systems and battlefield assets performs under the absolute harshest, most demanding conditions, every time.

Space & Satellite

Achieve mission success with expert space & satellite component testing that guarantees reliability in radiation and thermal extremes.

Medical

Guarantee medical components are safe with thorough component testing for regulatory compliance, reliability and effectiveness.

Automotive

Driving reliability and compliance through our comprehensive automotive component testing services

Industrial

Ensure your equipment is reliable with industrial component testing that boosts uptime, improves efficiency, enhances critical operations

Consumer Electronics

Avoid counterfeit risks, guarantee product performance, and deliver products to market with high confidence through robust testing