Component Authentication

Sample(s) will be tested in accordance with J-STD-002D (Method: Hot Dip and Look) examined for evidence of porosity, voids, coverage, inconsistent wetting, etc. Solderability varies depending on the type of solder alloy under discussion - and when using lead-free alloys can differ significantly from solderability when using lead based alloys. Solderability Tests includes thru-hole, SMD and BGA packages and is recommended for all devices more than two years old.

(Note: Destructive Test) AAA recommends 3 samples from each lot be subjected to Solderability Testing.