Testing Overview
Testing Overview
Our test and analysis capabilities were developed by an engineering staff with decades of semiconductor industry experience to provide cost effective, best-in-class electrical test services as well as counterfeit detection procedures that meet or exceed AS6081/AS6171 standards.
Electrical Testing
Passive Components Test
LCR meters measure a variety of characteristic parameters
Pin Correlation
Basic test that detects gross defects
Memory Test
For SRAM, EPROM, EEPROM & Flash products
Functional Testing
Measure published datasheet or source control document specifications
Component Authentication
External Visual Inspection
Microscopic inspection of component
RTS
Resistance to Solvents (RTS) testing
Solderability
Testing Leaded and BGAs
Internal Visual Inspection
Internal Device Inspection
X-Ray
Analysis for lead frame, die & wire bond
X-Ray Fluorescence
XRF lead finish inspection and RoHS testing
Scanning Electron Microscope (SEM)
Focused beam of electrons to analyze at the nanoscale
Energy-dispersive X-Ray Spectroscopy (EDS or EDX)
Analyze the elemental or chemical composition of a sample
Environmental Testing
Temperature, Humidity, Bias (THB) Test
Analyzes environmental effects on electronic components such as mechanical, optical (fogging), or hermetic failures
Highly Accelerated Stress Testing (HAST)
Evaluates the reliability of non-hermetic packaged solid-state devices in humid environments
Thermal Shock Testing
Analyzes the resistance of a part to temperature extremes, and the stress of cycling between those extremes
Burn In
For the purpose of detecting marginal devices with inherent defects or manufacturing aberrations
Vacuum Oven
A low-pressure oven has a lower boiling point, allowing drying treatments at a lower temperature
Value Added
Moisture Sensitive devices are typically baked for 24 hours at 125°C ± 5°C, depending on the package type.
Units are placed in anti-static ESD bags, along with desiccant, to keep the moisture inside the bag to a level <20% RH. Industry standard J-STD-033A used for handling moisture-sensitive devices.
Operations support a wide variety of standard surface mount, radial, axial and custom component package types.
Operations support a wide variety of standard surface mount, radial, axial and custom component package types.
Program/Erase services available on most programmable logic and memory products including FPGAs, CPLDs & Memory Products
Safely remove components from existing PCBs, restore leads for future assembly including re-balling, lead tinning, RoHS conversion, etc. and functionally test samples.
Other Testing
LED Color and Brightness Verification
5000V and 600A test for Power modules, IGBTs, etc.
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