Testing Overview

Our test and analysis capabilities were developed by an engineering staff with decades of semiconductor industry experience to provide cost effective, best-in-class electrical test services as well as counterfeit detection procedures that meet or exceed AS6081/AS6171 standards.

Electrical Testing

Passive Components Test

LCR meters measure a variety of characteristic parameters

Pin Correlation

Basic test that detects gross defects

Memory Test

For SRAM, EPROM, EEPROM & Flash products

Functional Testing

Measure published datasheet or source control document specifications

Component Authentication

External Visual Inspection

Microscopic inspection of component


Resistance to Solvents (RTS) testing


Testing Leaded and BGAs

Internal Visual Inspection

Internal Device Inspection


Analysis for lead frame, die & wire bond

X-Ray Fluorescence

XRF lead finish inspection and RoHS testing

Scanning Electron Microscope (SEM)

Focused beam of electrons to analyze at the nanoscale

Energy-dispersive X-Ray Spectroscopy (EDS or EDX)

Analyze the elemental or chemical composition of a sample

Environmental Testing

Temperature, Humidity, Bias (THB) Test

Analyzes environmental effects on electronic components such as mechanical, optical (fogging), or hermetic failures

Highly Accelerated Stress Testing (HAST)

Evaluates the reliability of non-hermetic packaged solid-state devices in humid environments

Thermal Shock Testing

Analyzes the resistance of a part to temperature extremes, and the stress of cycling between those extremes

Burn In

For the purpose of detecting marginal devices with inherent defects or manufacturing aberrations

Vacuum Oven

A low-pressure oven has a lower boiling point, allowing drying treatments at a lower temperature

Value Added

Moisture Sensitive devices are typically baked for 24 hours at 125°C ± 5°C, depending on the package type.

Units are placed in anti-static ESD bags, along with desiccant, to keep the moisture inside the bag to a level <20% RH. Industry standard J-STD-033A used for handling moisture-sensitive devices.

Operations support a wide variety of standard surface mount, radial, axial and custom component package types.

Operations support a wide variety of standard surface mount, radial, axial and custom component package types.

Program/Erase services available on most programmable logic and memory products including FPGAs, CPLDs & Memory Products

Safely remove components from existing PCBs, restore leads for future assembly including re-balling, lead tinning, RoHS conversion, etc. and functionally test samples.

Other Testing

LED Color and Brightness Verification

5000V and 600A test for Power modules, IGBTs, etc.